Cinch Connectivity | Powell Europe

CIN::APSE® Solderless Compression Connector Technology

It takes more than an ordinary connector to support advanced performance interconnect applications. CIN::APSE® is a proven solderless Z-axis connector technology that offers exceptional mechanical and electrical performance at signals well above 50GHz. In fact, the CIN::APSE solderless compression connector technology is the most widely implemented crimples and solderless high speed interconnect system for key industries including Commercial Aerospace, Space, Defense, Test & Measurement.

How CIN::APSE® Works

Connection

The connectors are constructed by two main components, insulating housing and an electrically conducting contact. The liquid crystal polymer insulators are molded and the contacts are a bundled gold-plated molybdenum wire. Gold plated copper spacers are used for long Z-axis connectors.

Positioning

The positioning is designed into the insulating housing. Insulation housing are molded for high volume and machined for prototypes.

Mounting

The connectors are positioned and mounted between boards and components using generally available alignment and compression hardware. Hardware can be press fit into PCB or utilized with a bolster plate for maintaining even compression across a large socket. Designers recommend PCB layout for gold plated pads and alignment holes locations.

Key Features

High Density

Maximize SWaP (Size, Weight, and Performance) for space and weight constrained designs
Pitch grid of 2.00 mm, 1.0 mm and 0.80 mm achievable
Thin profiles from 0.020" and greater
2-piece design reduces additional space and weight

Solderless

Compression sufficient for establishes multiple points of contact, RoHS compatible
No thermal processing or X-ray inspection required
Reversible mating process for multiple cycles

Customizable

Design team available for mechanical drawings and product sketches
Prototypes available for low quantities
Profile thicknesses from 0.020" to 1.0"
2 to 7,356 contacts have been used per connector, but no limit exists
IC-to-PCB, PCB-to-PCB, Flex-to-PCB, Component-to-PCB

Reliable

Excellent shock and vibration stability, 100 Gs shock, 20 Gs vibration
Thermally stable, life and cycle testing, 5,000 hrs @ 170°C
Electrically stable, > 1,000 MΩ @ 500 VDC

Datasheets and Catalogs

CIN::APSE® Brochure

View the complete technical documentation and product specifications for CIN::APSE® Solderless Compression Connector Technology.

View Brochure

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